Only source with integral gas injection; additional feedthroughs and manifolds are unnecessary.
2" & 3" Sputtering Sources for Research, Development & Prototype Production
Polaris™ sputtering sources deliver industrial performance in a compact format, combining integral gas injection, stable low-pressure operation, broad power capability, and modular installation flexibility for research, development, and prototype production work.



Industrial performance in a small package
Key brochure features include integral gas injection, stable low-power operation, higher usable power levels, modular design, multiple target mounting methods, and compatibility with DC, pulsed DC, RF, and AC modes. :contentReference[oaicite:1]{index=1}
Stable operation at very low powers and deposition rates.
Power levels up to 2x compared to competing designs.
Modular design with tilt mechanisms, variable positioning, shutters, and feedthrough adaptors among standard options.
Customized designs available.
“Unbalanced” magnet arrays and magnet modules for magnetic materials are available.
Bonded, clamped, and directly cooled targets supported.
Suitable for DC, Pulsed DC, RF, and AC power modes.
Robust construction, compact design, and practical vacuum reliability
Industrial robustnessPolaris™ sources can operate stably at low 10-4 Torr background pressures at very low power levels and can also support extremely high power levels because cooling water flow rates are nearly 2.5x those of competing sources. :contentReference[oaicite:2]{index=2}
Good vacuum practiceLarger coarse-thread screws are used because small fasteners gall and seize more easily in vacuum, especially when exposed to heat and redeposited material. Threaded vacuum connections on clamps and adjustable shields are intentionally avoided. :contentReference[oaicite:3]{index=3}
Simple, compact & reliablePush-to-connect water fittings, replaceable stainless water tubes, Ultem insulators, stainless shields, KF-40 clamps, and UHV-cleaned or electropolished vacuum parts help keep the source compact, serviceable, and reliable. :contentReference[oaicite:4]{index=4}


Integral gas injection improves plasma stability and film quality

Better process control
Because gas is injected through Polaris™ cathode bodies, process benefits are obtained (stable, low pressure operation, reduced insulating film growth and backscattered material on the target surface. - reduced arcing, denser films, better control of stoichiometry, etc.) and the source stays small. Process geometry variability becomes limited the bigger the source in small chambers.
Target material is deposited on manifolds, chimneys, sheilds and flakes off - causing arcing, shorting and other bad stuff. The less surface area the better. When gas distributors/manifolds sold by our competitorsare connected through the chamber wall at ground potential, the probability that the plasma will be disturbed increases (non-uniform films), rates drop and base pressures increase (lower ionization efficiency because electrons will more likely follow the ground path instead of remaining present in the plasma discharge.
A lasting investment with lower maintenance burden
Polaris™ sources emphasize a robust design, reliability, ease of maintenance and a low cost of ownership. We think you don't get good value for money if the purchase price is low, but the cost of maintenance is high and reliability low. The use of welded and brazed assemblies lowers the manufacturing cost, but doesn't consider how difficult it makes the source to clean and service. Aluminum erodes easily when vapor honed, grit blasted or, in most cases, chemically cleaned. A brazed insulator assembly or a feedthrough with a bellows welded to it experiencing a vacuum leak is an expensive repair. Every component in Polaris™ sources subjected to normal operation can be serviced or replaced by the user on site using, in most cases, commercially available parts and hardware.
Bonded, clamped, and directly water-cooled options

2 Inch Clamped Target Arrangement

2 Inch Bonded Target
Mounting options
Targets may be bonded, clamped or directly water-cooled, depending upon the target material, user preference and power level. Brittle, soft and low thermal conductivity materials should be bonded to the backing plate. This minimizes hot spots, insulating film growth and permits much higher power levels and rates of deposition compared to clamped targets. Targets can be clamped to a semi-permanent backing plate that remains attached to the cathode body. This method is appropriate only when low power levels are used for short duration. Directly water-cooled targets are recommended for high power/high rate sputtering of mechanically strong materials like refractory materials.
Backing plate design
All cathode bodies and target backing plates now feature a 12 hole pattern. This has several benefits. It allows the backing plate to be "semi-permanently" attached to the cathode body so that it does not have to be removed when exchanging clamped targets. It also allows brittle targets to be gently clamped without breaking them because the backing plate o-ring seal is loaded by the first set of screws holding the backing plate to the cathode body. Copper backing plates generally deflect too much on 3 inch sources when under vacuum and cooling water is flowing, causing bonded targets to separate from the backing plate and clamped targets to fracture and crack, although it can be used for structurally strong targets. 304 CRES (stainless steel) is supplied as standard and should be used. 2" sources are supplied with copper backing plates as standard.

2 Inch Directly Water-Cooled Target

Clamp and Backing Plate for 3 Inch Clamped Target
3 Inch Target Clamp and Backing Plate Assembled on Cathode Body"
3 Inch Source with "Semi-Permanent: Target Backing Plate Arrangement with Target Clamp Removed
Protected magnet module with balanced and custom array options


The magnet module resides in the cooling water cavity, ensuring maximum protection from overheating. The discrete magnets within the module are completely encapsulated and are protected from exposure to water. Polaris™ sources are supplied with a balanced magnet array as standard. Custom arrays for "unbalanced" magnetron sputtering and for sputtering magnetic materials can also be supplied. These arrays require a discussion with the customer about materials, process and expectations.
The basic sputtering source has a KF-40 bulkhead flange. Power, water and gas connections are made at atmosphere within it. A variety of standard feedthrough and installation kits mating with this flange are offered. To obtain the Installation Control Drawing for the specfic configuration that meets your needs, CLICK HERE. Please contact the factory if you don't find what you need on this web site.
Wide range of installation possibilities using industry-standard components
The basic sputtering source has a KF-40 bulkhead flange, with power, water, and gas connections made at atmosphere within it. A variety of standard feedthrough and installation kits mate with this flange, allowing adjustable positioning, shutters, and feedthrough adaptors using common industry components. :contentReference[oaicite:12]{index=12}
Basic Polaris Sputtering Module
2" & 3" Adjustable Position Polaris Sources
3" Polaris Shutter Assembly
2" Adjustable Position Polaris Source
3" Adjustable Position Polaris Source
1" Baseplate Feedthrough Adjustable Polaris Source
1" Baseplate Feedthrough Adjustable Polaris Source
Typical Utility Connections
Modular Design Allows Use of Industry Standard Components
2" & 3" Adjustable Position with Tilt & Shutter
Flange Mounted Assembly
Polaris on 1 Inch RF/DC Baseplate Feedthrough with Shutter
Research systems, optics applications, and complete sputtering packages
Application Example
Adjustable-position 3" Polaris™ in a UHV sputtering system for X-Ray optics, including the NSLS-II Multilayer Laue Lens Deposition System.
Application Example
Adjustable-position 3" Polaris™ in a UHV sputtering system for X-Ray optics, including the NSLS-II Multilayer Laue Lens Deposition System.
Complete Packages
1500 Watt DC and 300 Watt RF sputtering packages are available, with lower-cost package options for tighter budgets. :contentReference[oaicite:14]{index=14}
Complete Packages
1500 Watt DC and 300 Watt RF sputtering packages are available, with lower-cost package options for tighter budgets. :contentReference[oaicite:14]{index=14}