The system maintains stable operation throughout the target lifetime due to a wide uniform erosion area.
Precision sputtering technology
GEN II Round Magnetron Sputtering Sources
SunSource GEN II™ round magnetron sputtering sources are designed for stable operation through a wide uniform erosion area and active plasma discharge across nearly the entire target surface, minimizing distribution, uniformity, and rate changes while reducing insulating film growth and arcing. Argon gas injection through the cathode body eliminates the need for additional feedthroughs, external manifolds, and other plasma disturbing hardware, reducing required maintenance frequency, while the modular, user friendly design supports flexible configuration using industry standard components. The system operates across DC, pulsed DC, AC, RF and HIPIMS modes and provides higher deposition rates, while using a mechanically robust construction with high dielectric Ultem insulation, stainless steel water tubes, no flow restrictions, and no tapped holes in the cathode body.
Round Magnetron Sputtering Sources
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Typical GEN II Internal Mount Configuration
Typical GEN II Adjustable Internal Mount with Tilt & Shutter on CF Flange
Typical GEN II Flange Mount Configuration
Key Features
Built for consistent performance, flexibility, and reliable operation
Active plasma discharge across nearly the entire target surface keeps the target clean and minimizes insulating film growth and arcing.
Argon gas through the cathode body removes the need for external manifolds and additional plasma disturbing hardware.
The modular design allows tilt, adjustable height and position, shutter mechanisms, and mounting flange or feedthrough configurations using industry standard components.
The system is user friendly and serviceable.
The sources are available in 4" to 8" diameter targets with internal and flange mount configurations.
The system can be used in DC, pulsed DC, AC, RF, and HIPIMS modes.
The design achieves 35 to 40 wt% target utilization, supports low 10⁻⁴ Torr operation, enables fully stoichiometric dielectric materials at low pressures and temperatures.
SunSource
Basic Sputter Source
Optional Thermal Sprayed Anode Shields greatly reduce flaking and particulate generation.
Standard anode shields are electropolished
Features
High Reliabiilty - Low Cost of Ownership
Power, water & gas connections are made on the utility module. Push to connect water fittings eliminate leakage common with compression fittings. The module can be easily replaced by the user if any of the utility connections are damaged beyond repair or replacement. The need for a separate argon gas line and manifold is eliminated. No water flow restrictions within the cathode body or through the water fittings. The clear ID of the water tubing and it's length is the only restriction on flow. Water flow rates through SunSource GEN II™ sputtering sources can be nearly twice as high as competing sources.
i-Kote™ adaptive coating on target clamping ring and anode shield fasteners virtually eliminates galling and seizure of screws. Unlike silver plating and other coatings, fasteners with the i-Kote™ coating may be re-used many times. Experienced users know that Helicoil™ and other threaded inserts often are backed out of the cathode body when fastener galling occurs. Worse yet, the screw often seizes in the cathode body, requiring it to be drilled out and the body re-machined. The combination of the proprietary, easily removable cathode body target clamp threaded inserts and the i-Kote™ coating on the screws very significantly reduces cost of ownership and vastly improves uptime. Simply cut of either the flange on the insert or cut/break off the screw head, and replace them with inexpensive parts on-site. Access to a machine shop is not necessary.
Water, power & gas connections made at atmosphere through bulkhead KF-50 flange on Internal Mount Sources
4 threaded vented mounting points are provided
Summary of Operational/Maintenance Benefits Compared to Competing Sources
- Highest quality, not cheapest construction. Built to last.
- No screw insulators - less frequent maintenance and lower costs
- Very high dielectric strength insulators - withstands "ringing" of commercially available AC power supplies
- Anode shield does not utilize a threaded adjustable design, due to the high likelihood of galling during initial installation or adjustment.
- Unrestricted water flow through sputtering source
- Seizure of target clamp screws virtually eliminated
- Target clamps, shields and cathode body are not sputtered - they are not consumable items
Features
Process Benefits
Better Distribution Uniformity
Control of pressure and flow on the target surface made possible by argon gas injection through the cathode body enables a stable plasma discharge and uniform sputtering conditions.
Process asymmetries caused by poor pumping and flow conditions within the vacuum system are minimized.
Longer Useful Target Life
The target erosion profile shall remain relatively stable throughout target consumption and shall not exhibit severe pinch-off that causes significant shifts in deposited film uniformity.
Argon gas injection shall be provided through the cathode body to avoid localized venturi effects on the target surface. Designs that introduce process gas through fittings on the ground shield or through a separate chimney shall be avoided, as they can contribute to premature target burn-through.
Argon gas flows symmetrically through the cathode body and uniformly across the target surface, eliminating localized high pressure regions on the target surface. Premature target burn-through and skewed distribution are prevented. Argon gas flowing from the target surface creates a localized high pressure which reduces the tendency of sputtered material to redeposit on the target surface
Ideal for Reactively Deposited FilmsThe broad plasma discharge minimizes insulating film growth on the target surface which causes arcing. It also reduces redeposition of back-scattered material on the target in non-active areas. This is especially important when the redeposited material is highly stressed and likely to fracture, resulting in particulate generation and film defects. The efficient thermal design of SunSource™ sputtering sources lowers the tendency toward insulating nodular and whisker growth caused by hot spots on the target surface because the entire target assembly is uniformly cooled.
20% Higher Rate of Deposition Compared to Competing DesignsMore power can be applied to the target without negative side effects such as magnet degaussing and target overheating. The 6" round SunSource™ sputtering source has a 1 gpm higher flow rate compared to the next best competing product (5 gpm vs. 4 gpm at the same inlet and outlet pressures), resulting in 20% higher rates. The 4" round SunSource™ sputtering source can be run at continuous power levels of 7 kW (nominal 560 watts/in2) at 3 gpm compared to the next best competing source which has a maximum flow rate of 2 gpm at twice the inlet pressure
Modular Design
Easy and Inexpensive to Configure When Ordering or in the Future - Simple & Cheap Maintenance
The KF-50 bulkhead flange on the basic sputtering source allows the connection of a wide variety of feedthrough possibilities, including adjustable height, tilt, X-Y-Z positioning and shutter mechanisms. ISO, ASA and CF flanges can be added with the appropriate compression or other fitting welded to the flange. A few examples follow.
Adjustable height feedthrough with tilt mechanism. Both are options. Standard hydroformed bellows can be obtained from a multitude of standard component suppliers overnight, worldwide. The bellows is not welded to the either the feedthrough or the sputtering source assembly. It's not necessary to have access to a machine shop and welding capability to replace a failed bellows.
Typical shutter assembly, with flexible cable allowing easy installation of shutter mechanism in existing systems It's another option. Lightweight titanium shutter has a textured surface to minimize flaking and maximize material adhesion. Shutter is mounted on top of KF-50 bulkhead clamps on basic sputtering source. This allows anode shields to be cleaned simply and easily. Shutter is not mounted or welded to the side shield as is the case in competing designs. Ferrofluidic rotary feedthrough is provided - can be 1" baseplate feedthrough or 1.33" or 2.75" CF flange mounted version. Manual, pneumatic or electropneumatic versions can be provided.
Adjustable height, tilt and shutter mechanism installed on basic SunSource™ sputtering source. Shutter not installed.
Adaptive i-Kote™ coating is applied to threads on KF-50 stainless steel swing clamp that is part of tilt mechanism. Screws on assembly also have the coating applied.
Shutter mechanism with flexible cable and ferrofluidic rotary feedthrough.
SunSource GEN II™ with adjustable height feedthrough, tilt mechanism, manual shutter - mounted on 8" OD CF flange
Application Examples - Ion-assisted reactive sputtering system for DWDM filters